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Horizontal Grinding Machines for Advanced Material Wafers |
Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.
a).equipment main(cast iron)
b).spindle control system.
c).Automatic Dressing System of Grinding wheel.
d).Cold control system.
e).PLC touch control system.
f).Grinding wheel control system.
PLC Based 12’ Touch screen control panel
Independent control of grinding wheel and work piece rotation
Fixed or oscillating Grinding wheel Function
Automatic Tool Wear Compenstion
Automatic Measuring and Thickness Control
Data Management Capable
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Model |
NM-150H |
NM-250H |
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Machine Dimensions: (in/mm) |
53.5” (W) x 31.5” (D) x 60” (H) 1,360mm (W) x 800mm (D) x 1,515mm (H) |
57” (W) x 39” (D) x 63” (H) 1,450mm (W) x 1,000mm (D) x 1,600mm (H) |
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Wheel Speed (variable): |
1,500 RPM |
3,000 RPM |
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Work Speed (fixed): |
400 RPM |
400 RPM
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Maximum Work Size (in/mm): |
7” x 2” / 180mm x 50mm |
9.8” x 4” / 250mm x 100mm |
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Wheel Motor: |
220 VAC, 3-Phase, 0.40kW, 50/60 Hz |
220 VAC, 3-Phase, 1.50 kW, 50/60 Hz
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Accuracy: |
Within + 1µm |
Within + 0.5µm |
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Wheel Size: |
Ø180mm O.D. x 60mm I.D. |
Ø250mm O.D. x 170mm I.D. |
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Part Size - Thickness: |
Up to 2” / 50mm |
Up to 4” / 100mm |
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Part Size - Diameter: |
Up to 7” / 180mm |
Up to 9.8” / 250mm |
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Weight: |
1,763 lbs (800 kg) |
2,646 lbs (1,200 kg) |
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Electrical Service: |
220 VAC, 3-Phase, 50/60 Hz, 20Amp |
220 VAC, 3-Phase, 50/60 Hz, 20Amp |
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Air Line Required: |
0.6 MPa |
0.65 MPa |
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OPTIONS: |
• Chiller unit
• Cartridge filter & flow sensor
• Magnetic chuck
• Thickness sensor
• Grinding wheels |
• Chiller unit
• Cartridge filter & flow sensor
• Magnetic chuck
• Thickness sensor
• Grinding wheels | |
Flat Lapping Grinder Series
